EKF X-Series: XB1 Low Power COM Express™ Module

XB1

Low Power COM Express™ Basic Module

Description

XB1 Product Information
XB1 User Guide

BIOS Update
Graphics Drivers V. 14.24
Embedded Graphics Drivers
Ethernet Drivers
Chipset Software

E-Mail on BIOS Update
E-Mail bei BIOS Update

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XB1 COM Express™ Basic Module

Computer on Module
Scalable from 1GHz Ultra Low Voltage Celeron® M to 2.0GHz Pentium® M

COM Express™ (aka ETXexpress™) is an open PICMG® standard for Computer-On-Modules, based on new technologies such as PCI Express, Serial ATA, Gigabit Ethernet and SDVO. While designing the carrier board only once, users profit from upgrading or scaling their application by simply changing the CPU module.

Alternatively equipped with the Intel series of (LV) Pentium® M and ULV Celeron® M processors and up to 2GB RAM, the EKF XB1 is a versatile COM Express basic form factor module, designed especially for systems which require high performance at low power consumption.

XB1 - COM Express Computer On Module - See-Through Heatspreader

The chipset is based on PCI Express technology and has integrated a powerful dual screen graphics accelerator. The SDVO and VGA video interfaces allow for attachment of digital flat panel displays and analog monitors.

The XB1 is provided with a Gigabit Ethernet controller, and eight USB 2.0 ports for high speed communication. Four Serial ATA channels are available in addition to the legacy PATA I/F. The dual slot DIMM socket is suitable to address up to 2GB interleaved (symmetric) dual channel memory.

Typically, the XB1 will be combined with a custom specific carrier board. As a basic development tool, EKF can supply a variety of evaluation carrier boards. In addition, EKF offers their design services to create a turn-key ready customer solution.

The XB1 COM Express module is the perfect choice for embedded applications that require a low power standard processor at the centre of their design. OEMs can significantly improve their flexibility and reduce their total cost by adopting the open standards based architecture of COM Express.

Benefits of the XB1 COM Express Module

PICMG COM.0 Compliant Module Type 2
Pentium® M 2GHz (FSB 533MHz)
PCI Express Chipset for Embedded Applications
2 x 1GB DDR2 Memory (Dual Channel Mode Capable)
Dual-Screen Graphics Controller
Video I/F SDVO, PEG, LVDS, VGA, TV
Gigabit Ethernet Controller
4 x SATA I/F
8 x USB 2.0 Channels
RoHS Compliant
Low Power Generation Embedded Chipset and CPU
Carrier Boards XV1 XV2 XV3 Available

XB1 - COM Express Computer On Module

XB1 - View from Bottom Side

Feature Summary XB1
Form Factor	PICMG COM Express R1.0 (COM.0), Basic Module form factor (125x95mm²), Pin-out Type 2
Processor	Designed for Intel® Pentium® M Micro FC-BGA 479 processors (90nm Dothan), maximum junction temperature 100°C XB1-060: 600MHz ULV Celeron® M (Banias 130nm), 400MHz FSB, 512KB L2 cache, 7W XB1-100: 1.0GHz ULV Celeron® M (Dothan 373), 400MHz FSB, 512KB L2 cache, 5W XB1-140: 1.4GHz LV Pentium® M (Dothan 738), 400MHz FSB, 2MB L2 cache, 10W XB1-200/1: 2.0GHz Pentium® M (Dothan 760), 533MHz FSB, 2MB L2 cache, 27W
Chipset	Intel® i915 (Alviso) chipset consisting of: 82915GM Graphics/Memory Controller Hub (GMCH) with Intel® Graphics Media Accelerator (GMA) 900 82801FB I/O Controller Hub (ICH6) 82802 Firmware Hub (FWH)
Memory	Dual 200-pin SO-DIMM socket, DDR2 533 SDRAM, 2 x 1GB or 1 x 2GB maximum, symmetric dual channel capable
Video	Up to 2048x1536 pixel 16M colours @75Hz refresh rate (analog), up to 1600 x 1200 pixel 16M colours @60Hz (digital), dual screen support Dual SDVO Analog VGA Dual LVDS TV Out PEG PCI Express x 16 external graphics interface, multiplexed with SDVO
USB	8 x USB2.0
Ethernet	PCIe to Gigabit Ethernet controller 10/100/1000Mbps
PATA (IDE)	ICH6 integrated Ultra ATA/100 I/F
SATA	4 x SATA-150
GPIO	8 GPIO lines
Sound System	AC '97 or HD Audio Azalia (external Codec)
PCI	ICH6 integrated 32-bit PCI bridge, 133MBps CPCI master
PCI Express	3-Lane PCIe if PCIe Gigabit Ethernet controller is stuffed 4-Lane PCIe (configurable as x 4 Link) w/o PCIe Gigabit Ethernet controller (stuffing option)
BIOS	Phoenix BIOS, custom specific enhancements by EKF
Drivers	Intel graphics drivers Intel networking drivers
Power Requirements	+12V ±0.5V, typical current consumption: 0.8A idle / 1.4A 3D benchmark full power (Celeron® 373 1.0GHz) 1.7A idle / 3.1A 3D benchmark full power (Pentium® M 760 2.0GHz)
Environmental Conditions	Operating temperature: 0°C ... +60°C Storage temperature: -40°C ... +85°C, max. gradient 5°C/min Humidity 5% ... 95% RH non condensing Altitude -300m ... +3000m Shock 15g 0.33ms, 6g 6ms Vibration 1g 5-2000Hz
MTBF	tbd
EC Regulations	EN55022, EN55024, EN60950-1 (UL60950-1/IEC60950-1) 2002/95/EC (RoHS)
Typical Performance Rating Measured with PCMark2002 under Windows XP, 1GB DDR2 533	Board	Processor	CPU/MEM Score
	XB1-060	600MHz ULV Celeron® M (Banias)	tbd
	XB1-100	1.0GHz ULV Celeron® M (Dothan 373)	tbd
	XB1-140	1.4GHz LV Pentium® M (Dothan 738)	tbd
	XB1-201	2.0GHz Pentium® M (Dothan 760)	tbd

subject to change

XB1 Block Diagram

XB1 Assembly Drawing

XB1 Mounted on a XV2 Carrier Board

XB1 Mounted on a XV3 Carrier Board

Ordering Information
Alias	Ordering No.	Short Description
XB1	XB1-061	COM Express Basic Module, 600MHz ULV Celeron® M (Banias Generation), 1 x SODIMM socket provided
XB1	XB1-062	COM Express Basic Module, 600MHz ULV Celeron® M (Banias Generation), 2 x SODIMM sockets provided
XB1	XB1-101	COM Express Basic Module, 1.0GHz ULV Celeron® M (Dothan 373), 1 x SODIMM socket provided
XB1	XB1-102	COM Express Basic Module, 1.0GHz ULV Celeron® M (Dothan 373), 2 x SODIMM sockets provided
XB1	XB1-141	COM Express Basic Module, 1.4GHz LV Pentium® M (Dothan 738), 1 x SODIMM socket provided
XB1	XB1-142	COM Express Basic Module, 1.4GHz LV Pentium® M (Dothan 738), 2 x SODIMM sockets provided
XB1	XB1-201	COM Express Basic Module, 2.0GHz Pentium® M (Dothan 760), 1 x SODIMM socket provided
XB1	XB1-202	COM Express Basic Module, 2.0GHz Pentium® M (Dothan 760), 2 x SODIMM socket provided
XB1	XB1-HS00	Heat spreader for XB1 (COM.0 flat panel style)
XB1	XB1-HS20	Heat sink for XB1 (thermal extrusion style)
XB1	XB1-MM0	DDR2 memory module 512MB SO-DIMM
XB1	XB1-MM1	DDR2 memory module 1GB SO-DIMM
XB1	XB1-MM2	DDR2 memory module 2GB SO-DIMM

EKF Elektronik GmbH • Philipp-Reis-Str. 4 • 59065 Hamm • Germany
Phone +49 (0)2381/6890-0 • Fax +49 (0)2381/6890-90 • E-Mail